Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2004

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

DFX Guidelines
standard by Association Connecting Electronics Industries, 08/01/2021

Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 12/01/2011

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2017

Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 11/01/2017

Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison)
Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/2002

Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 08/01/2018