Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999

Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2012

Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
standard by Association Connecting Electronics Industries, 06/01/2006

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 04/16/2018

Accelerated Aging for Solderability Evaluations
standard by Association Connecting Electronics Industries, 12/01/1987

Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988

Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620
Handbook / Manual / Guide by Association Connecting Electronics Industries, 04/01/2018

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
standard by Association Connecting Electronics Industries, 09/01/2005

Qualification and Performance Specification for Printed Electronics on Flexible Substrates
standard by Association Connecting Electronics Industries, 03/08/2021

Surface Mount Land Pattern Round Robin Artwork
standard by Association Connecting Electronics Industries,